With the surge in demand for AI chips, server computing power has continuously increased, causing the thermal design power (TDP) of chips to nearly double.

Traditional air cooling solutions can no longer meet the needs of these high-wattage devices, making liquid cooling technology an increasingly viable solution.

 

Liquid cooling technology utilizes the high thermal conductivity of liquids to effectively dissipate generated heat.

Compared to air cooling systems, liquid cooling systems can handle higher power densities.

In AI servers, as chip wattages exceed 1000W, liquid cooling systems not only lower operating temperatures but also extend equipment lifespan.

 

Our company has a professional thermal management team that provides effective liquid cooling solutions for varying thermal densities and multiple heat sources.

We can customize different liquid cooling modules for our clients and possess experience in design, development, and mass production to meet the thermal performance requirements of various industries.