Heat Spreader
Heat Spreader (Lid)
A Jentech is a trusted name in the manufacturing industry, with decades of experience developing thermal solutions for various fields including automotive, 3C, and more. Our team works closely with our customers to understand their goals and constraints, to develop the best thermal solutions.
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Vapor chamber is a thin planar phase-changing heat transfer device with higher thermal performance to IHS
Vapor Chamber
HS Section View
HS is the metal cover of the CPU processor that protects the chip and provides a path for heat spreading.
Vapor Chamber
Vapor Chamber
Vapor chamber is a thin planar phase-changing heat transfer device with higher thermal performance to IHS
Lead Frame
Heat sink
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Stamped Cu heat sink with great heat conduction which is widely accepted by the market.
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Provide variety material selection.
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Multiple surface treatment option. (Ag/Ni/Pd/Au)
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Full plating
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Selective plating
Insulated metal substrate
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High precision forging heat sink.
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Provide variety insulation film.
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Great electrical insulation and high mechanical strength
Stamped/etching copper pattern
Insulation film
Stamping heat sink
Riveted Lead Frame
Lead Frame
High precision stamped lead frame
Multiple surface treatment options
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Ag
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Ni/ Pd /Au
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Selective Ni / Pd / Au
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Ni/ Ni Phosphorus
Riveted Parts
Precision integrate leadframe with heat sink.
Pre molding
PPA/ PCT/ LCP thermal plastic injection molding
EMC thermal set transfer molding
Copper Clip
Copper Clip is a component used in electronic devices and circuits. It is an essential component for efficient heat dissipation, stable electrical connections, and mechanical stability
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High Electrical Conductivity
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High Thermal Conductivity
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Ease of manufacture
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Customizable