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 Semiconductor

Lead Frame 

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Heat Sink

  • Stamped Cu heat sink with great heat conduction which is widely accepted by the market.

  • Provide variety material selection.

  • Multiple surface treatment option. (Ag/Ni/Pd/Au)

  • Full plating

  • Selective plating 

Insulated Metal Substrate

  • High precision forging heat sink.

  • Provide variety insulation film.

  • Great electrical insulation and high mechanical strength

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Stamped/etching copper pattern

Insulation film

Stamping heat sink

Copper Clip

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Copper Clip

Copper Clip is a component used in electronic devices and circuits. It is an essential component for efficient heat dissipation, stable electrical connections, and mechanical stability

 

  • High Electrical Conductivity

  • High Thermal Conductivity

  • Ease of manufacture

  • Customizable

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